Wafer-level micropackaging in thin film technology for RF MEMS applications

Publication date: 23 Ott 2017

JournalSource: OPENALEXOpenAlex type: articleClosed Access
Authors: Anna Persano, Pietro Aleardo Siciliano, Fabio Quaranta, Antonietta Taurino, Andrea Lucibello, R. Marcelli, Giovanni Capoccia, Emanuela Proietti, Alvise Bagolini, Jacopo Iannacci
Origin
Microsystem Technologies
Volume
24
Issue
1
Pages
575-585
Cited by
12
Legacy ID
de041d22e6b361b8f59e147e549558ff
Biblio references
Volume: 24 Issue: 1 Pages: 575-585