The simulation of moving or vibrating structures, getting energy loss right makes or breaks the forecast; to accurately capture this dissipative behaviour in practical applications, numerical modeling tools such as finite element analysis (FEA) should be used. This study examines two damping approaches, isotropic and anisotropic implemented within COMSOL Multiphysics environments for 3C-SiC resonators for MEMS applications, such as seismic and volcanic sensing and monitoring. The isotropic model relies on the standard scalar loss factor, while anisotropic damping uses a full symmetric 6×6 matrix, denoted ŋIJ, which captures directional variations in energy dissipation. This study shows that resonators with high internal stress have low damping and isotropic behavior, while wafers with reduced internal stress increased anisotropic dissipation. This suggests that residual stress plays a stabilizing role, suppressing direction-dependent losses. Furthermore, anisotropic damping shifts eigenvalues, alters frequency response curves, and modifies short-time transients.